Dow Corning TC-5688 Thermally Conductive Compound (3.5g) - 8.0w/m.k
Product details
| Management number | 205082604 | Release Date | 2025/10/18 | List Price | US$71.10 | Model Number | 205082604 | ||
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Dow Corning ®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.
*Note: This Item can not be shipped using DHL*
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